In collaboration with the Institute
of Technological Sciences, Wuhan University, as Chair Professor,
2019-present.
o Mechanics Simulation of Femtosecond Laser Chip Micro-nano Machining Based
on Multiscale High Performance Computing
Abstract: Femtosecond laser micromachining is the
cutting-edge technology of micromachining technology. The key of which is to
control the evolution of defects such as dislocations and cracks. The current
technical bottleneck lies in the lack of quantitative description and analysis
of complex mechanical phenomena in extreme situations. Through multiscale
parallel computing, this project proposes a molecular dynamics time-accelerated
computing scheme based on Bayesian network machine-learning to simulate the
evolution of large-scale complex systems. Molecular Dynamics and Material Point
Method are combined to simulate the dynamics of defects in femtosecond laser
micromachining. Three experimental observations will verify the simulation
results: the defect repair using femtosecond laser; the elongated deformation
of the laser-affected zone observed in during femtosecond laser ceramic
welding; and the fractal structure self-organized on the silicon wafer surface.
This project provides "Micro-nano machining mechanics simulation software
based on multiscale high-performance computing". As a simulation example,
the software is used to design the micro-nano processing technology of
femtosecond laser cutting of low-dielectric-constant silicon wafers.
HIGH PERFORMANCE COMPUTING
o High
performance computing - University of Aberdeen, UK
o High performance computing - Wuhan
University, China
o SAMRAI, Lawrence
Livermore National Laboratory, USA
o Accelerated Strategic
Computing Initiative (ASCI), Department of Energy, USA
o Center for Simulation
of Advanced Rockets, University of Illinois at Urbana-Champaign, USA
o Center
for the Simulation of Accidental Fires and Explosions, University of Utah,
USA
MULTISCALE SIMULATION
o Keynote Speaker. 2016. In vivo surface
roughness evolution of a stressed metallic implant. The 3rd International
Symposium on Multiscale Material Mechanics and Multiphysics and Sustainable
Applications, Hainan-Island, China, 6-10 November 2016.
o In 2015, the paper "Atomistic/continuum simulation of interfacial fracture Part II:
Atomistic/dislocation/continuum simulation"
was selected by Acta Mechanica Sinica for the "Special Award for
Outstanding Papers in the 30th Anniversary of the Publication".
o As one of the pioneers in combined atomistic and continuum simulation of
material processes, Dr Tan shared the First Prize of National Science and
Technology Progress Award by the State Education Commission of China, 1995.
o H. Tan and W. Yang, 1994. Atomistic/continuum
simulation of interfacial fracture part I: Atomistic simulation.
o H. Tan and W. Yang, 1994. Atomistic/continuum simulation of interfacial fracture Part II:
Atomistic/dislocation/continuum simulation.
o W. Yang, H. Tan and T. Guo, 1994. Evolution of crack tip process zones.