Digital Twin

In collaboration with the Institute of Technological Sciences, Wuhan University, as Chair Professor, 2019-present.

o   Mechanics Simulation of Femtosecond Laser Chip Micro-nano Machining Based on Multiscale High Performance Computing

Abstract: Femtosecond laser micromachining is the cutting-edge technology of micromachining technology. The key of which is to control the evolution of defects such as dislocations and cracks. The current technical bottleneck lies in the lack of quantitative description and analysis of complex mechanical phenomena in extreme situations. Through multiscale parallel computing, this project proposes a molecular dynamics time-accelerated computing scheme based on Bayesian network machine-learning to simulate the evolution of large-scale complex systems. Molecular Dynamics and Material Point Method are combined to simulate the dynamics of defects in femtosecond laser micromachining. Three experimental observations will verify the simulation results: the defect repair using femtosecond laser; the elongated deformation of the laser-affected zone observed in during femtosecond laser ceramic welding; and the fractal structure self-organized on the silicon wafer surface. This project provides "Micro-nano machining mechanics simulation software based on multiscale high-performance computing". As a simulation example, the software is used to design the micro-nano processing technology of femtosecond laser cutting of low-dielectric-constant silicon wafers.



o   High performance computing - University of Aberdeen, UK

o   High performance computing - Wuhan University, China

o   SAMRAI, Lawrence Livermore National Laboratory, USA

o   Accelerated Strategic Computing Initiative (ASCI), Department of Energy, USA

o   Center for Simulation of Advanced Rockets, University of Illinois at Urbana-Champaign, USA

o   Center for the Simulation of Accidental Fires and Explosions, University of Utah, USA



o   Keynote Speaker. 2016. In vivo surface roughness evolution of a stressed metallic implant. The 3rd International Symposium on Multiscale Material Mechanics and Multiphysics and Sustainable Applications, Hainan-Island, China, 6-10 November 2016.

o   In 2015, the paper "Atomistic/continuum simulation of interfacial fracture Part II: Atomistic/dislocation/continuum simulation" was selected by Acta Mechanica Sinica for the "Special Award for Outstanding Papers in the 30th Anniversary of the Publication".

o   As one of the pioneers in combined atomistic and continuum simulation of material processes, Dr Tan shared the First Prize of National Science and Technology Progress Award by the State Education Commission of China, 1995.

o   H. Tan and W. Yang, 1994. Atomistic/continuum simulation of interfacial fracture part I: Atomistic simulation.

o   H. Tan and W. Yang, 1994. Atomistic/continuum simulation of interfacial fracture Part II: Atomistic/dislocation/continuum simulation.

o   W. Yang, H. Tan and T. Guo, 1994. Evolution of crack tip process zones.